Tohoku University Technology: Method of manufacturing semiconductor package and its package: T20-454
It provide a manufacturing method that can suppress die shift
The Fan-out Wafer Level Package (FOWLP) method, which is the mainstream method for semiconductor packages, especially for mobile applications, has a problem of "die shift" in which mounted components shift by flow of sealing resin and wiring defects occurred. Further, even in a device such as a flexible display, there is a problem that a mounted component on the device is shifted when the device is bent. In order to solve the above problems, the invention is a method of manufacturing a semiconductor package without die shift by incorporating a special anchor layer under a mounting component and adopting a special manufacturing process, and the semiconductor package. The invention is expected to produce a highly integrated semiconductor package without a die shift, and to be applied to a flexible display and a wearable device.
- Company：Tohoku Techno Arch Co., Ltd.
- Price：Other
